The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1997
Filed:
Dec. 30, 1991
Applicant:
Inventors:
Kuo-Hua Lee, Lower Macungie Township, PA (US);
Chen-Hua D Yu, Allentown, PA (US);
Assignee:
Lucent Technologies Inc., Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437193 ; 437200 ; 437 20 ; 748D / ;
Abstract
An integrated circuit is described which has an electrical contact formed between a metallic silicide and .alpha.:Si. The method of integrated circuit manufacturing comprising the steps of: forming a layer of a metallic silicide; depositing a layer of .alpha.:Si on said metallic silicide at a temperature less than the recrystallization temperature; and increasing the conductivity of at least selected portions of said .alpha.:Si by ion implanting a species having the peak of its spatial distribution spaced from the .alpha.:Si-Silicide interface and the .alpha.:Si surface.