The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 1996
Filed:
Apr. 03, 1995
Applicant:
Inventors:
Jong-Kai Lin, Chandler, AZ (US);
William H Lytle, Chandler, AZ (US);
Ravichandran Subrahmanyan, Mesa, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437209 ; 437183 ; 437189 ; 437203 ;
Abstract
Interconnect bumps are formed on a circuit substrate using printing or dispensing techniques with a wet photoresist layer as a mask. A conductive paste is disposed in openings of a wet photoresist layer. The conductive paste is at least partially cured before the wet photoresist layer is removed. Alternatively, the wet photoresist layer may remain if it is a photo-imagable polyimide.