The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 1996
Filed:
Dec. 22, 1994
Junichiro Shibata, Urawa, JP;
Tokyo Electron Kabushiki Kaisha, Tokyo-to, JP;
Abstract
A semiconductor wafer probing method for reducing the number of times of an 'indexing' or wafer transfer operation and improving verification efficiency. In the semiconductor wafer probing method, a probe card has a first plurality of upright probe needles (e.g. sixteen) corresponding to chips (e.g. eight) arranged in a vertical or 'row' direction and chips (e.g. 2) arranged in a horizontal or 'column' direction. A first plurality of chips that can be verified by such a probe card is defined as an index region. A (second) plurality of index regions are arranged so as to minimize the number of occurrences where the probe needles will not have a chip to contact as the wafer and needles are moved relative to each other. Such (second) plurality of index regions is defined as a contact region 23.