The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 1996

Filed:

May. 22, 1995
Applicant:
Inventors:

Satoru Ogawa, Hirakata, JP;

Yasushi Sawada, Neyagawa, JP;

Masahiro Matsumura, Katano, JP;

Yoshihiko Nakamura, Nishinomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H / ;
U.S. Cl.
CPC ...
427535 ; 4272553 ; 427299 ; 427561 ; 427570 ; 427574 ; 427578 ;
Abstract

A surface treatment of a glass fabric used for a fiber reinforced composite such as multilayer circuit boards comprises the steps of exposing the glass fabric to an atmospheric pressure plasma of a mixture gas to obtain a plasma-treated surface of the glass fabric, and coating an organosilane compound on the plasma-treated surface. The mixture gas contains as a reaction gas at least one of an oxidative gas and a fluorine-containing gas, and a rare gas as a carrier of the reaction gas. The mixture gas is pre-heated prior to the plasma excitation thereof. When the glass fabric includes an organic compound as a sizing agent, the organic compound can be efficiently removed from the glass fabric by the exposing step. For example, the organosilane compound can be coated on the plasma-treated surface by exposing the plasma-treated surface to a second atmospheric pressure plasma of a second mixture gas containing an organosilane monomer. The surface treatment of the present invention is useful to efficiently produce a multilayer circuit board having excellent adhesion between the glass fabric and a resin, and resistance to CAF (Conductive Anodic Filaments).


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