The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 1996

Filed:

Sep. 08, 1995
Applicant:
Inventors:

Hiromi Tomiyama, Musashimurayama, JP;

Takeyuki Nakagawa, Akishima, JP;

Satoru Nagai, Iruma, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B / ;
U.S. Cl.
CPC ...
356372 ; 356384 ; 25055934 ;
Abstract

A method for evaluating the height of a wire bonded between a semiconductor chip and a lead frame including the steps of: investigating the correlation between wire height and wire width beforehand by shifting the focusing level of an optical system, setting a detection level which is the focusing level of the optical system based upon an upper limit level and a lower limit level which are to be the standard levels for the height of the wire to be detected. The acceptability of the height of the wire is judged by ascertaining whether or not the imaged width of the wire is within the wire width range which is between the upper and lower limit levels of the correlation between the wire height and the wire width.


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