The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 1996
Filed:
Jun. 02, 1995
Applicant:
Inventor:
Shigeru Ichikawa, Musashimurayama, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228102 ; 22818022 ;
Abstract
Method and apparatus for removing a chip from a bonding stage of a bonding machine via a vacuum suction of a collet upon exceeding a predetermined heating time so as to avoid thermal damage of the chip. The collet which vacuum-chucks the chip is moved vertically and then circularly by means of a combination of a drive shaft, a cam follower and a cylindrical cam holder so that the vacuum-chucked chip can be returned to the bonding stage or be transferred to other places.