The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 1996
Filed:
Jul. 18, 1995
Applicant:
Inventors:
Hugo W Chan, Rancho Palos Verdes, CA (US);
Arnold H Silver, Rancho Palos Verdes, CA (US);
Assignee:
TRW Inc., Redondo Beach, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ;
U.S. Cl.
CPC ...
216 33 ; 216 88 ; 216101 ; 505410 ; 505820 ;
Abstract
A multi-layer superconductive interconnect structure includes a first multi-layer substrate with a first superconducting layer (SL) deposited on a first epitaxial substrate and a first glue dielectric layer (GDL) on the first SL. A second multi-layer substrate includes a second SL deposited on a second epitaxial substrate and a second GDL on said second SL. The first GDL and the second GDL are clamped and cured together to form a composite substrate.
Quick Actions:
Chan, Hugo. (1996). Multi-layered superconductive interconnects (U.S. Patent No. 5578226). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5578226
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile