The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 1996

Filed:

Nov. 30, 1994
Applicant:
Inventors:

Satoru Mihara, Kawasaki, JP;

Daisuke Komada, Kasugai, JP;

Assignees:

Fujitsu Limited, Kawasaki, JP;

Fujitsu VLSI Limited, Kasugai, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H / ; H01L / ;
U.S. Cl.
CPC ...
1566431 ; 1566461 ; 216 69 ;
Abstract

A method for ashing a resist on a wafer in a plasma reaction chamber comprises the steps of flowing a non-activated oxygen containing gas into the plasma reaction chamber immediately before loading the wafer to the plasma reaction chamber, and then carrying out a plasma ashing of the resist. In one of the preferred embodiments, after the reaction chamber was exposed to the atmosphere and then evacuated to vacuum, a mixed gas of oxygen (90% in volume) and water vapor (10% in volume) was flown into the reaction chamber with 1000 seem and 1 Torr for 5 min. and subsequently the ashing was carried out. The method prevents the ashing rate from decreasing with ashing time.


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