The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 1996

Filed:

Jan. 17, 1995
Applicant:
Inventor:

Takeshi Kagamida, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N / ;
U.S. Cl.
CPC ...
356384 ; 356386 ; 25055924 ;
Abstract

The present invention relates to a wafer diameter/sectional shape measuring machine in which the diameter and the sectional shape of the wafer can be measured together. The diameter/sectional shape measuring machine is arranged in the wafer chamfering machine so that the chamfering conditions of the wafer can be adjusted in a short time without taking the wafer out from the wafer chamfering machine. The wafer diameter/ sectional shape measuring machine comprises a position control mechanism. The position control mechanism positions a center and an orientation flat of a wafer on a wafer table. The wafer table, which can rotate and move vertically, adsorbs and holds the wafer. A shape detector detects a sectional shape of the wafer. A measuring mechanism drives the shape detector in the direction of the wafer table and detects a moving value. The moving value is based on the distance that the measuring mechanism moves the shape detector. An image processing mechanism calculates the sectional shape of the wafer from the data detected by the shape detector. A size calculating mechanism calculates the diameter of the wafer in accordance with the signals from the image processing mechanism and the moving value.


Find Patent Forward Citations

Kagamida, Takeshi. (1996). Wafer diameter/sectional shape measuring machine (U.S. Patent No. 5555091). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5555091

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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