The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 1996
Filed:
Apr. 27, 1995
Applicant:
Inventors:
Hank H Shin, Gilbert, AZ (US);
Clarence J Tracy, Tempe, AZ (US);
Robert L Duffin, Mesa, AZ (US);
John L Freeman, Jr, Mesa, AZ (US);
Gordon Grivna, Mesa, AZ (US);
Syd R Wilson, Phoenix, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A01L / ; A01L / ; A01L / ;
U.S. Cl.
CPC ...
257765 ; 257771 ;
Abstract
A metallization alloy for semiconductor devices comprising aluminum, copper, and tungsten is provided. In a method for applying the metallization, the metal is sputtered onto a semiconductor substrate having devices formed therein. After deposition, the metallization is patterned and etched using conventional semiconductor photoresist and etch techniques.
Shin, Hank. (1996). Structure and method for metallization of semiconductor devices (U.S. Patent No. 5554889). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5554889
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile