The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 1996

Filed:

Jun. 06, 1994
Applicant:
Inventors:

Masaru Nikaido, Miura, JP;

Hidemi Kanetaka, Yokohama, JP;

Hideki Yamaguchi, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427108 ; 427359 ; 427370 ;
Abstract

An electron device-manufacturing method according to the invention comprises the steps of applying a resin coating layer, containing a solvent, to one of the surfaces of a substrate, directly or with a layer interposed therebetween; drying the resin coating layer to remove the solvent; and heating and pressing the resin coating layer to smooth the surface of the same. The method is characterized in that in the step of smoothing the surface of the resin coating layer, that side of the substrate on which the resin coating layer is not coated is mechanically supported by a supporting member, and a heating roller is brought into contact with the resin coating layer to press and heat the same, with another resin film interposed therebetween, which is thinner than the resin coating layer to be smoothed, thereafter releasing the interposed resin film.


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