The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 1996
Filed:
Mar. 23, 1995
Yoshinobu Kunitomo, Kyoto, JP;
Makoto Nozu, Kyoto, JP;
Yasuyuki Sakashita, Shiga, JP;
Masahide Tsukamoto, Nara, JP;
Seiichi Nakatani, Osaka, JP;
Keiji Saeki, Hyogo, JP;
Yoshifumi Kitayama, Osaka, JP;
Matsushita Electronics Corporation, Osaka, JP;
Abstract
The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in a matrix. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.