Process and apparatus for laser analysis of surface having a repetitive

Abstract

An analyzing laser system determines a physical characteristic of a repetitive texture pattern formed on a substrate surface. In one embodiment the system uses diffracted laser light to compute the average height of texturing bumps on a substrate surface. A laser beam is directed to the substrate surface and overlaps a group of individual marks or bumps formed in a repetitive pattern. A scanning linear photodector array receives light diffracted from the surface. The digitized output of the array is the angular distribution of diffracted light intensities. In the preferred embodiment for determining the average height of laser-induced bumps formed on a specular magnetic recording disk substrate, the angular positions of the first and second diffraction peaks or rings are determined and the intensities are integrated around those diffraction peaks or rings. These position and integrated intensity values are then compared to position and integrated intensity values for bumps of known height on calibration disk substrates. If the individual marks or bumps making up the repetitive pattern are also symmetrical then the angular distribution of diffracted light intensities is the square of the absolute value of the Fourier transform of the cross sectional profile of the bumps. Mathematical operations, including an inverse Fourier transform, are then performed on the digitized array output to yield the average cross sectional shape of the bumps illuminated by the analyzing laser.