The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 1996
Filed:
May. 09, 1994
Masahisa Kakinuma, Menuma-machi, JP;
Shigeru Komori, Konosu, JP;
Kazuhiro Yoshida, Ogawa-machi, JP;
Minoru Yokoshima, Toride, JP;
Tetsuo Ohkubo, Ube, JP;
Kazunori Sasahara, Shimonoseki, JP;
Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;
Taiyo Ink Manufacturing Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to a resist ink composition characterized by comprising a specific unsaturated polycarboxylic acid resin (A) or a specific unsaturated polycarboxylic acid/urethane resin (A'), a photopolymerization initiator (B), a diluent (C), and a curing component (D) and a cured article prepared therefrom. In the formation of a solder resist pattern via selective UV-exposure through a patterned film followed by development of the unexposed part, the composition of the present invention is excellent in developability even though at a small acid value (mg KOH/g) or over a prolonged drying time and shows a resistance of the exposed part against the developing solution. Further, a cured article prepared therefrom is excellent in electroless gold plating resistance and fully satisfactory in adhesion and soldering heat resistance.