The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 1996
Filed:
Sep. 07, 1993
Yoshimi Kinoshita, Amagasaki, JP;
Tomoyuki Kanda, Amagasaki, JP;
Katsuhisa Kitano, Amagasaki, JP;
Kazuo Yoshida, Amagasaki, JP;
Hiroshi Ohnishi, Amagasaki, JP;
Kenichiro Yamanishi, Amagasaki, JP;
Shigeo Sasaki, Tokyo, JP;
Hideki Komori, Tokyo, JP;
Taizo Eshima, Fukuoka, JP;
Kouichirou Tsutahara, Itami, JP;
Toshihiko Noguchi, Fukuoka, JP;
Toru Takahama, Amagasaki, JP;
Yoshihiko Kusakabe, Amagasaki, JP;
Takeshi Iwamoto, Amagasaki, JP;
Nobuyuki Kosaka, Amagasaki, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer(1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.