The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 1996

Filed:

Aug. 25, 1994
Applicant:
Inventors:

Tohru Tsujide, Tokyo, JP;

Toshiyasu Hishii, Tokyo, JP;

Kazuo Nakaizumi, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R / ; G01R / ;
U.S. Cl.
CPC ...
324757 ; 324754 ; 324760 ;
Abstract

The apparatus for collectively burning-in or testing a plurality of semiconductor chips disposed on a wafer without dicing the chips into individuals, the apparatus including a testing substrate, an active circuit disposed on the testing substrate for activating chips disposed on the wafer to be tested, a plurality of pads disposed on the testing substrate and positioned so that the pads are disposed in alignment with bonding pads of the chips disposed on the wafer when the testing substrate is overlaid on the wafer, and an anisotropic conductive layer disposed on the pads.


Find Patent Forward Citations

Tsujide, Tohru. (1996). Apparatus for testing semicondctor wafer (U.S. Patent No. 5532610). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5532610

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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