The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 1996
Filed:
Jan. 23, 1995
Wolfgang Hoenlein, Unterhaching, DE;
Siegfried Schwarzl, Neubiberg, DE;
Siemens Aktiengesellschaft, Munich, DE;
Abstract
A method used in manufacturing a cubically integrated circuit arrangement. A silicon wafer, wherein through pores are produced by electrochemical etching are insulated from the silicon wafer, and are provided with conductive fills, is secured as a carrier plate (24) to a substrate (21) that has components and that is integrated in a cubically integrated circuit arrangement. Terminal pads (25) that are electrically connected to conductive fills and that are arranged on the surface of the carrier plate (24) thereby meet contacts (23) to the components that are arranged at the surface of the substrate (21) adjoining the carrier plate (24) and that are firmly connected thereto.