The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 1996

Filed:

Jun. 21, 1994
Applicant:
Inventors:

Seiji Nishizawa, Hamura, JP;

Tokuji Takahashi, Osaka, JP;

Ryo Hattori, Itami, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B / ; G01B / ;
U.S. Cl.
CPC ...
356355 ; 356346 ; 356357 ;
Abstract

An interference waveform dispersion spectrum of light reflected from a multi-layer film is compared to a waveform obtained by numerical calculation using an optical characteristic matrix. Respective layer thickness values obtained from the calculated analysis of the Spatial interference waveform are subjected to waveform fitting with actually measured values. The theoretical interference spectrum is recalculated while changing approximate values of the layer thicknesses until a match is obtained to obtain precise respective layer thicknesses. The thicknesses of respective layers of a thin multi-layer film of submicron thicknesses can be non-destructively measured exactly and stably without direct contact.


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Nishizawa, Seiji. (1996). Method and apparatus for measuring the thicknesses of layers of a (U.S. Patent No. 5523840). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5523840

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