The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 1996

Filed:

Jun. 29, 1995
Applicant:
Inventors:

Byung C Lim, Kyungki, KR;

Yoo S Hong, Seoul, KR;

Ki Y Lee, Kyungki, KR;

Tae H Park, Kyungki, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C / ;
U.S. Cl.
CPC ...
501 18 ; 501 15 ; 501 47 ; 501 75 ; 501 17 ;
Abstract

The present invention relates to low temperature sealing glass compositions using ceramic composite filler useful for sealing alumina ceramic package, in particular, to compositions for hermetic-sealing cap and base of alumina package which consists of a solid PbO-B.sub.2 O.sub.3 glass powder and a filler selected from zinc zirconium silicate composite or magnesium aluminum zirconium silicate composite as a low thermal expansion ceramic composite. The used composite filler composes of zircon and willemite crystal phase or zircon and cordierite crystal phase uniformly mixed on the filler and has the low thermal expansion coefficient of 20.degree..about.40.degree..times.10.sup.-7 /.degree.C.


Find Patent Forward Citations

Lim, Byung. (1996). Sealing glass compositions using ceramic composite filler (U.S. Patent No. 5510300). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5510300

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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