Exposure method and apparatus using holographic techniques

Abstract

An exposure apparatus is used for reproducing a mask pattern of a semiconductor device or the like onto a photosensitive substrate using a holography. The holography is utilized also in a process for alignment between a mask pattern hologram and an exposure region of the substrate. The pattern hologram is recorded to a recording medium by interference between an object wave from the pattern and a reference wave, and a second hologram is formed to the medium by diffraction light from an alignment mark formed on the mask. Prior to reconstruction of the pattern image, reconstruction light from the second hologram, illuminated with a reconstruction wave, is irradiated onto the substrate arranged in place of the mask. A reproduction image of the alignment mark on the substrate surface illuminated with the reconstruction light is measured, and relative displacement between the medium and the substrate is detected from a result of the measurement. The relative positional relationship between the medium and the substrate is corrected in accordance with the displacement information, and, thereafter, the surface is exposed with a reconstruction image of the pattern hologram.