The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 1996

Filed:

Sep. 19, 1994
Applicant:
Inventors:

Ronald K Kerschner, Loveland, CO (US);

David T Crook, Loveland, CO (US);

Lisa M Kent, Loveland, CO (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R / ;
U.S. Cl.
CPC ...
324530 ; 324 67 ; 324688 ; 324750 ; 324 725 ;
Abstract

Disclosed is a system that determines whether input and output leads of semiconductor components are present and properly soldered to a printed circuit board. The system includes a signal source which is connected to a wiring trace on the printed circuit board, which is soldered to the lead being tested. A capacitive test probe is placed on top of the component and connected to a capacitance measuring device. The signal source signal is capacitively coupled through the lead of the integrated circuit package being tested to the capacitive test probe, so if a predetermined capacitance is measured by the capacitance measuring device, the lead is connected to the circuit assembly. As the capacitances being measured are small, the capacitive test probe may include an amplifier, a shield or a buffer circuit to reduce stray capacitance.


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