The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 1996
Filed:
Jun. 07, 1995
Shouji Usui, Tokyo, JP;
Taketoshi Inagaki, Kawasaki, JP;
Kiyomasa Kamei, Tokyo, JP;
Takeshi Matsutani, Machida, JP;
Kazunori Imaoka, Komae, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device includes a semiconductor layer which has a first surface, and a second surface which is comparatively lower than the first surface. The semiconductor device also has a first material layer formed over the second surface, which includes a first inorganic material which has a hardness exceeding that of the semiconductor layer. The semiconductor device also includes a second material layer which has a hardness less than that of the first material layer, and which is formed in a gap between a sidewall of the first material layer and a sidewall between the first and second surfaces. The first surface of the semiconductor layer is formed by lapping until the first surface of the semiconductor layer is impeded by the first material layer so that the first surface of the semiconductor layer is substantially flush with a top surface of the first material layer.