The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 1996

Filed:

Mar. 17, 1994
Applicant:
Inventors:

Kaoru Shinbara, Shiga, JP;

Yasuhiro Kurata, Shiga, JP;

Masashi Sawamura, Shiga, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; B08B / ; A46B / ;
U.S. Cl.
CPC ...
15 211 ; 15 882 ; 134902 ;
Abstract

A substrate treatment apparatus includes a loader 1 for soaking a plurality of wafers W in deionized water, a back surface cleaning portion 2, a front surface cleaning portion 3, a rinsing and drying unit 4 and a plurality of transporting units 6. The back surface cleaning unit 2 cleans the back surface of the wafer W with a brush from the lower side by supplying deionized water to the wafer W that is removed from the loader 1. The front surface cleaning unit 3 cleans the upper surface of the wafer W with a brush by supplying deionized water to the wafer W cleaned by the back surface cleaning unit 2. The rinsing and drying unit 4 rinses the cleaned wafer W and then dries it. There is a transporting unit 6 disposed between the loader 1 and the back surface cleaning unit 2, another unit 6 is disposed between unit 2 and the upper surface cleaning unit 3, and another unit 6 is disposed between unit 3 and the rinsing and drying unit 4 while each of these three transporting units 6 transports the wafer W, deionized water is supplied to the wafer W to prevent being dried during the cleaning treatment.


Find Patent Forward Citations

Loading…