The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 1996

Filed:

Mar. 16, 1995
Applicant:
Inventors:

Nobuto Yamazaki, Tachikawa, JP;

Shinichi Kumazawa, Higashikurume, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B / ;
U.S. Cl.
CPC ...
364506 ; 364560 ; 348126 ; 382146 ;
Abstract

In inspecting a bend of a wire which is bonded to, for example, a semiconductor device, a straight scale line with scale markings of constant intervals and a bonded-point line, both lines crossing each other at right angles, are shown on a monitor. An image of a wire that has a bend is monitored by a camera and displayed on a monitor. By overlapping the image of the bend of the wire on the scale line and then reading a scale marking which is closest to the bend of the wire, it is possible to ascertain the amount of the bend of the wire.


Find Patent Forward Citations

Yamazaki, Nobuto. (1996). Method and apparatus for inspecting bent portions in wire loops (U.S. Patent No. 5485398). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5485398

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…