The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 1996
Filed:
Dec. 05, 1994
Francis J Carney, Gilbert, AZ (US);
George F Carney, Tempe, AZ (US);
Douglas G Mitchell, Tempe, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method for forming an electrical interconnect on a substrate. At least one pad (14) is formed on a substrate (11). The pad (14) is formed having a non-wetting surface (12) and a wettable surface (13). Photoresist (44) is patterned on a substrate (41) forming a cavity on a pad (46) leaving a non-wetting surface (42) and a wettable surface (43) exposed. Interconnect material (56) is formed on a non-wetting surface (52) and a wettable surface (53) of pad 57. Interconnect material (56) is reflowed forming an interconnect ball (74) on a wettable surface (73). Surface tension causes interconnect material (56) when reflowed to flow from a non-wetting surface (72) to the wettable surface (73) and ball up to form the interconnect ball (74).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile