The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 1995

Filed:

Aug. 19, 1994
Applicant:
Inventors:

Arnold W Yanof, Tempe, AZ (US);

William Dauksher, Mesa, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437209 ; 437206 ; 437211 ; 437214 ; 437217 ;
Abstract

A semiconductor structure (8) comprising a semiconductor chip support structure (9), a circuit board substrate (40) with circuit board substrate probes (36) extending therefrom and a method for fabricating the semiconductor structure (8). The semiconductor chip support structure (9) includes, for example, clips (43, 53) to replaceably mount semiconductor chips (47, 48) to the semiconductor chip support structure (9). The circuit board substrate (40) is mated with the semiconductor chip support structure (9) so that the circuit board substrate probes (36) contact bonding pads (49) on the semiconductor chips (47, 48). If a semiconductor chip (47, 48) becomes damaged, the circuit board substrate (40) may be separated from the semiconductor chip support structure (9) and the damaged semiconductor chip (47, 48) replaced with a good semiconductor chip (47, 48).


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