The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 1995
Filed:
Oct. 16, 1992
Junichi Kasai, Kawasaki, JP;
Kazuto Tsuji, Kawasaki, JP;
Norio Taniguchi, Kawasaki, JP;
Takashi Mashiko, Kawasaki, JP;
Masao Sakuma, Kawasaki, JP;
Yukio Saigo, Satsuma, JP;
Yoshiyuki Yoneda, Kawasaki, JP;
Masashi Takenaka, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Kyushu Fujitsu Electronics Limited, Satsuma, JP;
Fujitsu Automation Limited, Kawasaki, JP;
Abstract
A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.