The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 1995
Filed:
Sep. 10, 1993
Takao Mori, Kanagawa, JP;
Satoshi Yoshida, Hachioji, JP;
Tadahiko Nishimukai, Sagamihara, JP;
Kenji Yamaguchi, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
A method of assembling a semiconductor chip on a tape carrier has the steps of stacking, on a film carrier having a first group of metal leads, another film carrier having a second group of metal leads and bonding the two film carriers together by adhesive to form a laminated structure. The first and second groups of metal leads are so disposed that they do not contact and do not cross one another. The tips of the metal leads of the two groups are bonded to the electrodes on the semiconductor chip. The metal leads are formed in advance on the corresponding film carriers by etching. By stacking the plurality of film carriers, the connection pitch can be reduced while eliminating a necessity for reducing the thickness of each lead.