The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 1995

Filed:

Mar. 25, 1994
Applicant:
Inventors:

Daisaku Akiyama, Amagasaki, JP;

Yoshiro Maki, Amagasaki, JP;

Assignee:

MEC Co., Ltd., Amagasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03C / ;
U.S. Cl.
CPC ...
430331 ; 252 791 ; 252 794 ; 252150 ; 252173 ; 134-3 ; 134 41 ; 216106 ;
Abstract

A composition suitable for the treatment of surfaces of copper and copper alloys is disclosed. It comprises, (a) a cupric complex of an azole compound, (b) an organic acid having a boiling point or a decomposition point of 230.degree. C or lower, (c) a difficultly volatile complexing agent, (d) a complexing agent having a complexing power which is weaker than that of the azole compound, and (e) water. The treatment of copper or copper alloys with the composition produces abraded surface with moderate irregularities, thereby ensuring better adhesion of various resists thereto and increased solderability. The composition is particularly useful for the manufacture of printed-wiring boards.


Find Patent Forward Citations

Loading…