The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 1995
Filed:
Mar. 30, 1994
Applicant:
Inventors:
Yasuhito Suzuki, Itami, JP;
Kazunari Michii, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257670 ; 257672 ; 257667 ;
Abstract
A lead frame for semiconductor devices which does not require tie bar cutting in the manufacture of semiconductor devices includes a base lead frame having no tie bars and a dummy lead frame having dummy leads filling gaps between outer lead portions of the leads when the dummy lead frame is mounted on the base lead frame. Instead of tie bars, the dummy leads reinforce the leads and also stop molten sealing resin from flowing into the gaps between the outer lead portions during resin molding.