The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 1995
Filed:
Nov. 18, 1992
Neil H Judell, Andover, MA (US);
Technology Development Group, Inc., Weston, MA (US);
Abstract
A method and apparatus involving the use of a thickness measurement probe having a predetermined resolution to measure the thickness of a wafer over a two-dimensional area of the wafer, the method including sampling the measured thickness of the wafer with the probe to generate an image of the two-dimensional area of the wafer, the image being a two-dimensional array of measurements, each measurement representing a measurement of the thickness of a different region of the two-dimensional area, the two-dimensional array of measurements being represented by a measured column tensor; and left multiplying the measured column tensor by a reconstruction tensor T to obtain an estimate of a desired measurement column tensor, where the reconstruction tensor T is equal to R.sub.dm R.sub.mm.sup.-1, R.sub.dm being a cross-covariance tensor computed for d, a desired measurement column tensor, and m, the measured column tensor, and R.sub.mm being an auto-covariance tensor computed for m, and wherein the estimate of a desired measurement column tensor represents an estimate of measurements that would be obtained from a hypothetical probe assembly having a different resolution from the first mentioned probe.