The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 1995

Filed:

Apr. 14, 1993
Applicant:
Inventors:

Tetsuya Homma, Tokyo, JP;

Mieko Suzuki, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437195 ; 437235 ; 437228 ;
Abstract

A method of manufacturing a semiconductor device, incorporates the steps of: performing reactive ion etching using a fluorine compound gas to surface-treat the lower level wirings which permits selective deposition of the second silicon oxide film; selectively depositing a second silicon oxide film between said lower level wirings by a CVD method using an organic silicon compound gas and an oxidizable gas as source gases; depositing a third silicon oxide film on an entire surface and forming through holes connected to the lower wirings; and forming upper level wirings connected to the lower level wirings. Further, an additional silicon oxide film can be deposited on the major surface so as to form a side wall thereof on the lower level wirings. The reactive ion etching is then performed.


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