The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 1995
Filed:
Feb. 28, 1989
Sahag R Dakesian, Sudbury, MA (US);
William E Wesolowski, Holden, MA (US);
Raytheon Company, Lexington, MA (US);
Abstract
A method for applying an extremely thin layer of an adherent material to a substrate at a controllable rate. The disclosed embodiment provides a method for depositing a thin layer of titanium, typically much less than 100 Angstroms, on a silicon dioxide substrate layer in order to provide the necessary adhesion for a metallic film. A silicon wafer having a layer of silicon dioxide is placed on a titanium precoated carrier in an evacuated chamber. The wafer and carrier are then sputter etched using argon as a sputter etchant while titanium is deposited onto the wafer. The ratio of deposition rate to etching rate is controlled to provide a very low effective deposition rate. Thus, while the surface is being atomically cleaned, the adhesive layer is simultaneously deposited. A film of a noble metal, typically platinum, may then be deposited onto the adhesive layer. In an alternative embodiment, the titanium is sputter deposited from a target while the substrate is simultaneously sputter etched.