The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 1995
Filed:
Nov. 10, 1993
Shigemitsu Watanabe, Kanagawa, JP;
Masaki Kasahara, Kanagawa, JP;
Tadashi Ono, Kanagawa, JP;
Akira Shiga, Kanagawa, JP;
Tsukasa Yamada, Kanagawa, JP;
Kiyohide Sakihama, Kanagawa, JP;
Shin-ichi Sakaguchi, Kanagawa, JP;
Masato Shimoyama, Kanagawa, JP;
Mitsumi Electric Co., Ltd., , JP;
Abstract
An object of the invention is to provide a method of forming a fine conductive pattern. The method allows the fine conductive pattern whose thickness is relatively large to be formed easily, accurately, and surely. An insulating layer is formed on a substrate. A pattern resist is formed on the insulating layer. Then, the insulating layer is etched downward based on a profile of the pattern resist in a first etching step, and sidewalls of each of groove portions formed by the etching step of the insulating layer are etched sideways in a second etching step, so that overhang portions are defined at the lower edges of the pattern resist portions. Then, conductive film portions are formed by depositing a conductor on the pattern resist, and conductive films that are on the pattern resist are lifted off, so that a fine conductor pattern can be prepared.