The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 1995

Filed:

Jul. 21, 1993
Applicant:
Inventors:

Kimiyasu Sano, Yokohama, JP;

Masayuki Endo, Yokohama, JP;

Atsufumi Shimada, Yokohama, JP;

Yasuaki Yokoyama, Yokkaichi, JP;

Nobuo Bessho, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08K / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
524356 ; 524366 ; 524378 ; 524379 ; 524755 ; 524761 ; 524765 ; 524769 ; 524770 ; 525100 ; 5263291 ; 5263292 ; 5263296 ; 528 27 ; 522114 ; 522120 ; 522129 ;
Abstract

An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained from (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.


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