The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 1995
Filed:
Feb. 23, 1993
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
A hot press molded body or an HIP molded body having one of a composition comprising R: 10-20 atomic %, B: 3-20 atomic %, and a total amount of one or a plurality of Ga, Zr, and Hf: 0.001-5.0 atomic %, a remainder comprising Fe and unavoidable impurities; or a composition comprising R: 10-20 atomic %, B: 3-20 atomic %, and a total amount of one or a plurality of Ti, V, Nb, Ta, Al, and Si: 0.001-5.0 atomic %, a remainder comprising Fe and unavoidable impurities; or a composition comprising Co: 0.1-50 atomic % added to one of the above compositions, having an aggregate structure of crystallized grains having as a main phase thereof a R.sub.2 Fe.sub.14 B type or R.sub.2 (Fe, Co).sub.14 B type intermetallic compound having a tetragonal structure, the crystallized grains having dimensions of 0.05-20 .mu.m; and individual crystallized grains comprising more than 50 volume % of the total crystallized grains comprising the aggregate structure, have a value of less than 2 of a ratio b/a of a smallest grain diameter a and a largest grain diameter b.