The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 1995
Filed:
Sep. 24, 1992
Applicant:
Inventors:
Kazuhiro Ando, Ibaraki, JP;
Takamasa Kawakami, Ibaraki, JP;
Yasuhiro Shouji, Ibaraki, JP;
Yasuo Tanaka, Tokyo, JP;
Takeo Kanaoka, Tokyo, JP;
Norio Sayama, Tokyo, JP;
Assignee:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25F / ;
U.S. Cl.
CPC ...
204130 ; 156630 ;
Abstract
A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.
Ando, Kazuhiro. (1995). Process for producing copper clad laminate (U.S. Patent No. 5382333). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5382333
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile