Conical magnetron sputter source

Abstract

The sputtering source of the present invention comprises a means for providing DC or RF power and cooling to a conical target electrode with magnets thereabout and anode at the bottom. At the center of the sputtering source is a grounded anode. A plurality of magnets which form rings are located behind the conical target electrode so that the magnetic field lines point to the anode. The conical target electrode has an inner surface which is slightly inclined from a centerline. The conical target electrode is concentrically located about the vertical centerline. A ground shield is placed about and above the magnets and the conical electrode and further acts to eliminate high energy ions from reaching the substrate because of the shape thereof. An opening in the shield allows for the exit of low energy particles of the target material sputtered from the conical target electrode. The sputtering source provides a narrow beam of target material for deposition on a substrate located at a distance from the source.