The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 1995
Filed:
Feb. 23, 1993
MEMC Electronic Materials, Inc., St. Peters, MO (US);
Abstract
Wafer polishing apparatus includes a turntable having a polishing surface thereon, and a frame mounting the turntable for rotation relative to the frame about an axis. A pressure plate mounted by a spindle rotates about an axis spaced from the axis of rotation of the turntable, but is held from rotation about the axis of rotation of the turntable. The pressure plate is constructed for simultaneously holding multiple wafers with a polish face of the wafers facing the polishing surface of the turntable. The wafers are pressed against the polishing surface of the turntable by a cylinder which applies a force to the pressure plate. A floating head assembly operatively connecting the wafers to the pressure plate reorients the wafer relative to the pressure plate in response to pressure differentials over the polish face of the wafer engaging the polishing surface to substantially equalize the pressure distribution over the polish face of the wafer.