The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 1994

Filed:

Sep. 21, 1993
Applicant:
Inventors:

Yoshio Yokota, Tokyo, JP;

Mitsuhiko Kitagawa, Tokyo, JP;

Dai Karasawa, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257341 ; 257327 ; 257328 ; 257329 ; 257773 ; 257775 ;
Abstract

A semiconductor device having a bipolar MOS composite element pellet suitable for a compression structure. In this pellet, a semiconductor substrate on which a MOS composite element is formed is electrically connected to an external part by an electrode plate compressed to the substrate.


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