The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 1994
Filed:
Oct. 01, 1992
Applicant:
Inventors:
Assignee:
Hyundai Electronics Industries Co. Ltd., Kyoungki-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437195 ; 437245 ;
Abstract
A method for forming a via hole in multiple metal layers of the semiconductor device is disclosed. In a via hole forming process of the semiconductor device, a barrier layer is formed beneath the photoresistive layer. Accordingly, the polymer residue formed on the metal-layer pattern and side wall of the via hole is prevented during the plasma etching process.