The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 1994
Filed:
Sep. 21, 1992
Nobuyuki Yasutake, Tokyo, JP;
Akio Yamada, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
An electron beam exposure apparatus comprises an electron beam source, a holder for supporting a semiconductor substrate, a beam patterning part for patterning the electron beam, a beam focusing system for focusing the patterned electron beam on the semiconductor substrate, and a beam deflector system for deflecting the focused electron beam. The beam deflector comprises at least first, second and third coil assemblies connected in series for producing first through third magnetic fields respectively such that the first through third magnetic fields extend generally perpendicularly to the beam path of the electron beam at respective vertical levels on the beam path. The beam deflection means further comprises fourth and fifth coil assemblies for producing fourth and fifth magnetic fields respectively wherein the fourth coil assembly is disposed such that the fourth magnetic field extends generally parallel to the second magnetic field for correcting the second magnetic field and the fifth coil means is disposed such that the fifth magnetic field extends generally parallel to the third magnetic field for correcting the third magnetic field. Further, the electron beam exposing apparatus includes a driving system for energizing the beam deflector by driving the fourth and fifth coil assemblies independently from the first through third coils, so that the electron beam is deflected by a desired deflection angle and hits the semiconductor substrate substantially vertically at a desired location without the coma aberration.