The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 1994
Filed:
Oct. 13, 1992
Applicant:
Inventor:
Yoichi Ohshima, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257784 ; 257786 ;
Abstract
A contact plug formed in a contact hole formed in a boron-containing BPSG insulating film, and a pad bed formed under a bonding pad portion of a wiring are formed of a three-layered polysilicon film, thus reducing the number of fabrication steps. A protective film may be provided on the pad bed. This structure facilitates the formation of the pad bed and protects the pad bed that prevents film shearing at the bonding pad portion, thereby improving the adhesion to the insulating film.
Ohshima, Yoichi. (1994). Semiconductor integrated circuit device having an improved bonding pad (U.S. Patent No. 5365112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5365112
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile