The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 1994
Filed:
Jan. 08, 1993
United Microelectronics Corporation, Hsinchu, TW;
Abstract
A new metallization method for metal lines formation of a very large scale integrated circuit (VLSI) is described. The metal lines are formed in a 'wavy' or 'snaky' pattern. It is a 'wavy' pattern when the metal line goes through a vertically vibratory path. It is a 'snaky' pattern when a metal line goes through a horizontally vibratory path. This includes both uniform and random 'wavy' and 'snaky' patterns. A metal line can also be formed in a pattern that is both 'wavy' and 'snaky.' For the 'wavy' pattern, the topography under the metal lines is fabricated using, for example, field oxide. The 'wavelength' can vary from 1 to 10 micrometers. A slight modification of the metal mask can produce the 'snaky' structure of the metal line. The stresses will be released by a small curvature change of the metal line. For the contact structures, a multi-contact layout with 'wavy' structure can release more stress than can a single-contact layout of the same contact area.