The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 1994
Filed:
Apr. 07, 1993
Haruo Mishina, Ushiku, JP;
Masato Itagaki, Kashiwa, JP;
Hitachi Techno Engineering Co. Ltd., Tokyo, JP;
Abstract
A reflow soldering apparatus comprises a preheating chamber and a reflow chamber, both of which are furnished with a plurality of means for circulating a hot gas being composed of a cross flow blower, a divergent nozzle, a heater, a temperature sensor, a temperature controller, and a power regulator etc. The cross-flow blowers above a conveyer are arranged in a back to back manner and the blowers beneath the conveyer are arranged in a face to face manner, and soldering is performed by impinging the hot gas upon a circuit substrate being transferred by the conveyer. A reflow soldering apparatus having a small temperature fluctuation in the preheating chamber and the reflow chamber, high reliability in the soldering by maintaining a desired temperature profile, and preferable economy is provided.