The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 1994
Filed:
Feb. 25, 1991
Applicant:
Inventors:
Kunio Miyazaki, Hitachi, JP;
Yutaka Sugita, Tokorozawa, JP;
Akio Mukoh, Mito, JP;
Tadahiko Miyoshi, Hitachi, JP;
Osamu Miura, Hitachi, JP;
Akio Takahashi, Hitachiota, JP;
Shunichi Numata, Hitachi, JP;
Satoru Ogihara, Hitachi, JP;
Kazuji Yamada, Hitachi, JP;
Hirokazu Inoue, Ibaraki, JP;
Fumiyuki Kobayashi, Sagamihara, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174250 ; 174255 ; 174264 ; 361784 ;
Abstract
An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.