The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 1994
Filed:
Jun. 25, 1993
John H Hall, San Jose, CA (US);
Other;
Abstract
An interconnect for an integrated circuit in a semiconductor substrate formed on an insulation layer on a surface of the substrate includes a first layer of a refractory metal nitride on said insulation layer, a layer of refractory metal on said first layer of refractory metal nitride, and a second layer of refractory metal nitride on said Layer of refractory metal, said first layer of refractory metal layer nitride, said layer of refractory metal, and said second layer of refractory metal nitride forming said interconnect structure. The interconnect structure makes contact with the integrated circuit through openings in the insulation layer. Boron ions are implanted into the substrate through the interconnect structure in the openings to facilitate ohmic contact between the substrate and the interconnect structure.