The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 1994

Filed:

Jul. 10, 1992
Applicant:
Inventors:

Raymond A Letize, West Haven, CT (US);

William J DeCesare, Wolcott, CT (US);

Lucia Justice, Waterbury, CT (US);

Assignee:

MacDermid Incorporated, Waterbury, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
156666 ; 156640 ; 156664 ; 252 791 ; 252 795 ;
Abstract

An alkaline solution for the microetching of copper in the course of printed circuit manufacture is provided by combining components which are a source of cupric ion, ammonium hydroxide and/or a source of ammonium ion, and a compound, other than ammonia, which is a chelator for cupric ion in the alkaline environment of the solution. The microetchant composition is stable, brings about a desired microroughening of the copper surface with minimal removal of copper, is easily regenerated, and does not promote pink ring. When an organosilane through-hole conditioning agent is included in the composition, the composition can be used as a means for effecting in one step the microetching and conditioning steps of a printed circuit through-hole metallization process.


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