The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 1994

Filed:

Mar. 29, 1993
Applicant:
Inventors:

James M Weaver, Madison, CT (US);

Ehud Efrat, Horsham, PA (US);

Daniel J Muldoon, Hatboro, PA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228102 ; 228-45 ; 228104 ; 2281805 ;
Abstract

Apparatus for monitoring the length of a fine wire tail made after the second bond of a fine wire interconnection includes a continuity circuit and a wire bond monitoring system (WBMS) in an automatic wire bonder. The Z axis position of the bonding tool is sensed to determined the height of the bonding tool on second bond and at the time the fine wire breaks from second bond. The monitoring circuit determines if the wire clamps are initiated and when and if the electronic flame-off control is fired. Logic circuit in the WBMS determine if wire tail after second bond is of a proper length to make a ball on the wire tail and if not, what remedial measures must be made to avoid damage to the semiconductor device being bonded.


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