The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 1994
Filed:
Oct. 18, 1991
Applicant:
Inventor:
Ken Nakao, Sagamihara, JP;
Assignee:
Tokyo Electron Sagami Limited, Kanagawa, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B / ; F27B / ;
U.S. Cl.
CPC ...
219542 ; 219385 ; 219395 ; 219536 ; 338316 ; 392416 ; 392418 ;
Abstract
The heat treatment apparatus according to the invention comprising a process tube for holding a plurality of semiconductor wafers, a heating resistive element made mainly of molybdenum silicide and surrounding the process tube, a heat insulating member surrounding the heating resistive element and having a layer which made of material inert to silicon dioxide and faces the surface of the heating resistive element, and a securing member securing the heating resistive element to the heat insulating member, and made of material inert to silicon dioxide.